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RT9722 Datasheet(PDF) 10 Page - Richtek Technology Corporation |
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RT9722 Datasheet(HTML) 10 Page - Richtek Technology Corporation |
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10 / 14 page ![]() RT9722 10 DS9722-00 August 2011 www.richtek.com pin requires a pull-up resistor, this resistor should be large in value to reduce energy drain. A 100k pull-up resistor works well for most applications. In the case of an over- current condition, FLG will be asserted only after the flag response delay time, tD, has elapsed. This ensures that FLG is asserted only upon valid over-current conditions and that erroneous error reporting is eliminated. For example, false over-current conditions may occur during hot-plug events when a highly large capacitive load is connected and causes a high transient inrush current that exceeds the current limit threshold. The FLG response delay time tD is typically 12ms at VIN = 5V. Under-Voltage Lockout Under-voltage lockout (UVLO) prevents the MOSFET switch from turning on until input voltage exceeds approximately 2V. Under-voltage detection functions only when the chip enable input is enabled. Thermal Shutdown Thermal shutdown is employed to protect the device from damage if the die temperature exceeds approximately 150 °C. If enabled, the switch automatically restarts when the die temperature falls 20 °C (typ.). The output will continue to cycle on and off until the device is disabled or the fault is removed. Short Circuit Protection The current limit circuitry prevents damage to the MOSFET switch and external load. When a heavy load or short circuit is applied to an enabled switch, a large transient current may flow until the current limit circuitry responds. Once this current limit threshold is exceeded, the device enters constant current mode until the thermal shutdown occurred or the fault is removed. Supply Filter/Bypass Capacitor A 1 μF low-ESR ceramic capacitor from VIN to GND (the amount of the capacitance may be increased without limit), located at the device is strongly recommended to prevent the input voltage drooping during hot-plug events. However, higher capacitor values will further reduce the voltage droop on the input. Furthermore, without the bypass capacitor, an output short may cause sufficient ringing on the input (from source lead inductance) to destroy the internal control circuitry. An important note to be award of is the parasitic inductance of PCB traces can cause over-voltage transients if the PCB trace has even a few tens of nH of inductance. The input transient must not exceed 6.0V of the absolute maximum supply voltage even for a short duration. Power Dissipation The device's junction temperature depends on several factors such as the load, PCB layout, ambient temperature and package type. The maximum output current must be derated at higher ambient temperature to ensure the junction temperature does not exceed operating junction temperature 125 °C. With all possible conditions, the junction temperature must be within the range specified under operating conditions. Power dissipation can be calculated based on the output current and the RDS(ON) of switch as below. PD = RDS(ON) x IOUT2 The application may limit the amount of output current based on the total power dissipation and the ambient temperature. Thermal Considerations The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = (TJ(MAX) − TA) / θJA Where TJ(MAX) is the maximum operation junction temperature, TA is the ambient temperature and the θJAis the junction to ambient thermal resistance. For recommended operating conditions specification of RT9722, the maximum operating junction temperature is 125 °C. The junction to ambient thermal resistance θJA for SOT-23-5/SOT-23-6 package is 250 °C/W and WDFN-6L 2x2 package is 165 °C/W on the standard JEDEC 51-3 single-layer thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by following formula : PD(MAX) = (125 °C − 25°C) / (250°C/W) = 0.4W for SOT-23-5/SOT-23-6 package |
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