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QG5000XSL9TH Datasheet(PDF) 6 Page - Intel Corporation |
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QG5000XSL9TH Datasheet(HTML) 6 Page - Intel Corporation |
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6 / 458 page ![]() 6 Intel® 5000X Chipset Memory Controller Hub (MCH) Datasheet 5.3.4 Data Poisoning in Memory...................................................................... 314 5.3.5 Patrol Scrubbing ................................................................................... 314 5.3.6 Demand Scrubbing ............................................................................... 315 5.3.7 x8 Correction ....................................................................................... 315 5.3.8 Single Device Data Correction (SDDC) Support ......................................... 316 5.3.9 FB-DIMM Memory Configuration Mechanism ............................................. 316 5.3.10 FB-DIMM Memory Failure Isolation Mechanisms ........................................ 318 5.3.11 DDR2 Protocol...................................................................................... 322 5.3.12 Memory Thermal Management................................................................ 322 5.3.13 Electrical Throttling ............................................................................... 333 5.4 Behavior on Overtemp State in AMB................................................................... 333 5.5 Interrupts....................................................................................................... 334 5.6 XAPIC Interrupt Message Delivery...................................................................... 334 5.6.1 XAPIC Interrupt Message Format ............................................................ 334 5.6.2 XAPIC Destination Modes ....................................................................... 335 5.6.3 Interrupt Redirection............................................................................. 336 5.6.4 EOI..................................................................................................... 338 5.7 I/O Interrupts ................................................................................................. 338 5.7.1 Ordering.............................................................................................. 338 5.7.2 Hardware IRQ IOxAPIC Interrupts........................................................... 339 5.7.3 Message Signalled Interrupts ................................................................. 339 5.7.4 Non-MSI Interrupts - “Fake MSI” ............................................................ 339 5.8 Interprocessor Interrupts (IPIs) ......................................................................... 340 5.9 Chipset Generated Interrupts ............................................................................ 342 5.9.1 Intel 5000X Chipset Generation of MSIs.................................................. 344 5.10 Legacy/8259 Interrupts .................................................................................... 346 5.11 Interrupt Error Handling ................................................................................... 346 5.12 Enterprise South Bridge Interface (ESI) .............................................................. 347 5.12.1 Power Management Support................................................................... 348 5.12.2 Special Interrupt Support....................................................................... 348 5.12.3 Inbound Interrupts ............................................................................... 348 5.12.4 Legacy Interrupt Messages .................................................................... 349 5.12.5 End-of-Interrupt (EOI) Support .............................................................. 349 5.12.6 Error Handling...................................................................................... 349 5.13 PCI Express Ports ............................................................................................ 349 5.13.1 Intel 5000X Chipset MCH PCI Express Port Overview ................................ 350 5.13.2 Enterprise South Bridge Interface (ESI) ................................................... 351 5.13.3 PCI Express Ports 2 and 3 ...................................................................... 351 5.13.4 PCI Express General Purpose Ports.......................................................... 352 5.13.5 Supported Length Width Port Partitioning................................................. 353 5.13.6 PCI Express Port Support Summary ........................................................ 354 5.13.7 PCI Express Port Physical Layer Characteristics ......................................... 355 5.13.8 Link Layer............................................................................................ 357 5.13.9 Flow Control......................................................................................... 359 5.13.10Transaction Layer ................................................................................. 361 5.14 Power Management.......................................................................................... 361 5.14.1 Supported ACPI States .......................................................................... 361 5.14.2 FB-DIMM Thermal Management .............................................................. 362 5.14.3 FB-DIMM Thermal Diode Overview .......................................................... 362 5.15 System Reset.................................................................................................. 362 5.15.1 MCH Power Sequencing ......................................................................... 362 5.15.2 MCH Reset Types.................................................................................. 363 5.15.3 Targeted Reset Mechanism .................................................................... 364 5.15.4 BINIT# Mechanism ............................................................................... 365 5.15.5 Reset Sequencing ................................................................................. 365 5.16 SMBus Interfaces Description ............................................................................ 366 |
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