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16C84 Datasheet(PDF) 97 Page - Microchip Technology

Part # 16C84
Description  8-bit CMOS EEPROM Microcontroller
PDF  110 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

16C84 Datasheet(HTML) 97 Page - Microchip Technology

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PIC16C84
 1996-2013 Microchip Technology Inc.
DS30445D-page 97
13.0
PACKAGING INFORMATION
13.1
K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
* Controlling Parameter.
† Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed
0.003” (0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall
not exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
PCB Row Spacing
0.300
7.62
Number of Pins
n
18
18
Pitch
p
0.100
2.54
Lower Lead Width
B
0.013
0.018
0.023
0.33
0.46
0.58
Upper Lead Width
B1†
0.055
0.060
0.065
1.40
1.52
1.65
Shoulder Radius
R
0.000
0.005
0.010
0.00
0.13
0.25
Lead Thickness
c
0.005
0.010
0.015
0.13
0.25
0.38
Top to Seating Plane
A
0.110
0.155
0.155
2.79
3.94
3.94
Top of Lead to Seating Plane
A1
0.075
0.095
0.115
1.91
2.41
2.92
Base to Seating Plane
A2
0.000
0.020
0.020
0.00
0.51
0.51
Tip to Seating Plane
L
0.125
0.130
0.135
3.18
3.30
3.43
Package Length
D‡
0.890
0.895
0.900
22.61
22.73
22.86
Molded Package Width
E‡
0.245
0.255
0.265
6.22
6.48
6.73
Radius to Radius Width
E1
0.230
0.250
0.270
5.84
6.35
6.86
Overall Row Spacing
eB
0.310
0.349
0.387
7.87
8.85
9.83
Mold Draft Angle Top
51015
5
10
15
Mold Draft Angle Bottom
51015
5
10
15
R
n
2
1
D
E
c
eB
E1
p
A1
L
B1
B
A
A2
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging



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