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PIC16CE623 Datasheet(PDF) 97 Page - Microchip Technology

Part # PIC16CE623
Description  OTP 8-Bit CMOS MCU with EEPROM Data Memory
PDF  114 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16CE623 Datasheet(HTML) 97 Page - Microchip Technology

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 1998-2013 Microchip Technology Inc.
DS40182D-page 97
PIC16CE62X
14.0
PACKAGING INFORMATION
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
3.30
3.56
3.81
5.33
5.08
4.83
.210
.200
.190
W2
Window Length
.150
.140
.130
W1
Window Width
10.80
9.78
8.76
.425
.385
.345
eB
Overall Row Spacing
0.53
0.47
0.41
.021
.019
.016
B
Lower Lead Width
1.52
1.40
1.27
.060
.055
.050
B1
Upper Lead Width
0.30
0.25
0.20
.012
.010
.008
c
Lead Thickness
3.81
3.49
3.18
.150
.138
.125
L
Tip to Seating Plane
23.37
22.86
22.35
.920
.900
.880
D
Overall Length
7.49
7.37
7.24
.295
.290
.285
E1
Ceramic Pkg. Width
8.26
7.94
7.62
.325
.313
.300
E
Shoulder to Shoulder Width
0.76
0.57
0.38
.030
.023
.015
A1
Standoff
4.19
4.06
3.94
.165
.160
.155
A2
Ceramic Package Height
4.95
4.64
4.32
.195
.183
.170
A
Top to Seating Plane
2.54
.100
p
Pitch
18
18
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
1
2
D
n
W2
E1
W1
c
eB
E
p
L
A2
B
B1
A
A1
*Controlling Parameter
JEDEC Equivalent: MO-036
Drawing No. C04-010
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging



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