AD8114/AD8115

Rev. B | Page 8 of 32

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

Supply Voltage

12.0 V

Internal Power Dissipation1

AD8114/AD8115 100-Lead

Plastic LQFP (ST)

2.6 W

Input Voltage

Output Short-Circuit Duration

Observe power

derating curves

Storage Temperature Range2

−65°C to +125°C

100-lead plastic LQFP (ST):

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8114/AD8115 is limited by the associated rise in junction

temperature. The maximum safe junction temperature for

plastic encapsulated devices is determined by the glass transition

temperature of the plastic, approximately 125°C. Temporarily

exceeding this limit may cause a shift in parametric performance

due to a change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 125°C for an extended

period can result in device failure.

While the AD8114/AD8115 are internally short-circuit

protected, this may not be sufficient to guarantee that the

maximum junction temperature (125°C) is not exceeded under

all conditions. To ensure proper operation, it is necessary to

observe the maximum power derating curves shown in Figure 5.

AMBIENT TEMPERATURE (

°C)

5

4

3

2

1

0

–50 –40 –30 –20 –10

0

10

20

30

40

50 60

70

80

90

Figure 5. Maximum Power Dissipation vs. Temperature

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.