LM2931CSSLASHNOPB datasheet(10/29 Pages) TI1

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LM2931-N

SNOSBE5G – MARCH 2000 – REVISED APRIL 2013

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TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Maximum Power Dissipation

(TO-263) (1)

On/Off Threshold

Figure 32.

Figure 33.

Output Capacitor ESR

Figure 34.

(1)

The maximum power dissipation is a function of maximum junction temperature TJmax, total thermal resistance θJA, and ambient

temperature TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax − TA)/θJA. If this dissipation is

exceeded, the die temperature will rise above 150°C and the LM2931-N will go into thermal shutdown. For the LM2931-N in the TO-92

package,

θJA is 195°C/W; in the SOIC-8 package, θJA is 160°C/W, and in the TO-220 package, θJA is 50°C/W; in the DDPAK/TO-263

package,

θJA is 73°C/W; and in the 6-Bump DSBGA package θJA is 290°C/W. If the TO-220 package is used with a heat sink, θJA is the

sum of the package thermal resistance junction-to-case of 3°C/W and the thermal resistance added by the heat sink and thermal

interface.If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally

connected to the package: Using 0.5 square inches of copper area,

θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W;

and with 1.6 or more square inches of copper area,

θJA is 32°C/W.

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