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LM3263TMX/NOPB Datasheet(PDF) 23 Page - Texas Instruments |
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LM3263TMX/NOPB Datasheet(HTML) 23 Page - Texas Instruments |
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23 / 39 page ![]() LM3263 www.ti.com SNVS837 – JUNE 2013 APPLICATION INFORMATION Recommended External Components Inductor Selection A 1.5 µH inductor is needed for optimum performance and functionality of the LM3263. In the case of 2G transmission current bursts, the effective overall RMS current requirements are reduced. Therefore, please consult with the inductor manufacturers to determine if some of their smaller components will meet your application needs even though the classical inductor specification does not appear to meet the LM3263 RMS current specifications. The LM3263 automatically manages the inductor peak and RMS current (or steady-state current peak) through the SW pin. The SW pin has two positive current limits. The first is the 1.45A typical (or 1.65A maximum) over- current protection. It sets the upper steady-state inductor peak current (as detailed in the Electrical Characteristics Table ILIM,PFET,SteadyState). It is the dominant factor limiting the inductors ISAT requirement. The second is an over-limit current protection. It limits the maximum peak inductor current during large signal transients (i.e., < 20 µs) to 1.9A typical (or 2.1A maximum). A minimum inductance of 0.3uH should be maintained at the second current limit. The ACB circuit automatically adjusts its output current to keep the steady-state inductor current below the steady-state peak current limit. Thus, the inductor RMS current will effectively always be less than the ILIM,PFET,SteadyState during the transmit burst. In addition, as in the case with 2G where the output current comes in bursts, the effective overall RMS current would be much lower. For good efficiency, the inductor’s resistance should be less than 0.2 Ω; low DCR inductors (<0.2Ω) are recommended. Table 2 suggests some inductors and their suppliers. Table 2. Suggested Inductors and Their Suppliers ISAT Model Vendor Dimensions (mm) (30% drop in DCR inductance) DFE201610C1R5N TOKO 2.2A 120 m Ω (1285AS-H-1R5M) LQM2MPN1R5MG Murata 2.0A 110 m Ω 2.0 x 1.6 x 1.0 MAKK2016T1R5M Taiyo-Yuden 1.9A 115 m Ω VLS201610MT-1R5N TDK 1.4A 151 m Ω Capacitor Selection The LM3263 is designed to use ceramic capacitors for its input and output filters. Use a 10 µF capacitor for the input and approximately 10 µF actual total output capacitance. Capacitor types such as X5R, X7R are recommended for both filters. These provide an optimal balance between small size, cost, reliability and performance for cell phones and similar applications. Table 3 lists suggested part numbers and suppliers. DC bias characteristics of the capacitors must be considered while selecting the voltage rating and case size of the capacitor. Smaller case sizes for the output capacitor mitigate piezo-electric vibrations of the capacitor when the output voltage is stepped up and down at fast rates. However, they have a bigger percentage drop in value with dc bias. For even smaller total solution size, 0402 (1005) case size capacitors are recommended for filtering. Use of multiple 2.2 µF or 1µF capacitors can also be considered. For RF Power Amplifier applications, split the output capacitor between DC-DC converter and RF Power Amplifiers: 10 µF (COUT1) + 4.7 µF (COUT2) + 3 x 1.0 µF (COUT3) is recommended. The optimum capacitance split is application dependent, and for stability the actual total capacitance (taking into account effects of capacitor DC bias, temperature de-rating, aging and other capacitor tolerances) should target 10 µF with 2.5V DC bias (measured at 0.5 VRMS). Place all the output capacitors very close to the respective device. A high-frequency capacitor (3300 pF) is highly recommended to be placed next to COUT1. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Links: LM3263 |
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