RB520CS30L

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 1 — 10 March 2011

10 of 14

NXP Semiconductors

RB520CS30L

11. Soldering

Reflow soldering is the only recommended soldering method.

Fig 14. Reflow soldering footprint SOD882

solder lands

solder resist

occupied area

solder paste

sod882_fr

0.9

0.3

(2

×)

R0.05 (8

×)

0.6

(2

×)

0.7

(2

×)

0.4

(2

×)

1.3

0.5

(2

×)

0.8

(2

×)

0.7

Dimensions in mm