Technical Note 71

TABLE OF CONTENTS

Table of Contents .....................................................................................................................1

1

Objective ..............................................................................................................................2

2

VTI'S DIL-8 and DIL-12 packages .......................................................................................2

3

Package Outline and Dimensions......................................................................................2

4

Tape and reel specifications ..............................................................................................3

5

Printed Circuit Board (PCB) Level Guidelines ..................................................................5

5.1

Recommended PCB pad layout................................................................................................5

5.2

Solder paste and Cleaning process .........................................................................................5

5.3

Stencil .........................................................................................................................................6

5.4

Paste printing .............................................................................................................................6

5.5

Component picking and placement .........................................................................................6

5.6

Reflow soldering ........................................................................................................................6

5.7

Moisture sensitivity level (MSL) classification........................................................................7

5.8

Inspection ...................................................................................................................................8

6

Hand Soldering Guidelines ................................................................................................9

7

Rework Guidelines ............................................................................................................10

7.1

Instructions for desoldering and removing of component ..................................................10

8

Environmental Aspects ....................................................................................................11

9

References.........................................................................................................................11

10 Document Change Control...............................................................................................12

Assembly Instructions for SCA6x0 and SCA10x0 series