MDD312 datasheet(4/4 Pages) IXYS

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20130813g

MDD 312

IXYS reserves the right to change limits, test conditions and dimensions.

10-3

10-2

10-1

100

101

102

0.00

0.05

0.10

0.15

0.20

0.25

thJC

[K/W]

100

125

150

200

400

600

800

500

1000

1500

2000

2500

3000

10-3

10-2

10-1

100

101

102

0.00

0.05

0.10

0.15

0.20

3 x MDD312

Circuit

B6U

0.3

0.2

0.15

0.1

0.06

0.03

0.4

thKA K/W

180°

120°

60°

30°

60°

120°

180°

FAVM [A]

A [°C]

tot

[W]

Fig. 8 Three phase rectifier bridge: Power dissipation vs. direct output current & ambient temperature

t [s]

thJK

[K/W]

Fig. 9 Transient thermal impedance junction to case (per diode)

Fig. 10 Transient thermal impedance junction to heatsink (per diode)

thJC for various conduction angles d:

thJC (K/W)

0.120

180°C

0.128

120°C

0.135

60°C

0.153

30°C

0.185

Constants for Z

thJC calculation:

i R

thi (K/W)

i (s)

1 0.0058

0.00054

2 0.031

0.098

3 0.072

0.54

4 0.0112

thJK for various conduction angles d:

thJK (K/W)

0.160

180°C

0.168

120°C

0.175

60°C

0.193

30°C

0.225

Constants for Z

thJK calculation:

i R

thi (K/W)

i (s)

1 0.0058

0.00054

2 0.031

0.098

3 0.072

0.54

4 0.0112 12

5 0.04

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