DSPIC33FJ32GP302THSLASHSP datasheet(321/403 Pages) MICROCHIP

321 / 403 page

 2009 Microchip Technology Inc.

Preliminary

DS70292D-page 321

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04

30.0

ELECTRICAL CHARACTERISTICS

This section provides an overview of dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, and dsPIC33FJ128GPX02/

X04 electrical characteristics. Additional information is provided in future revisions of this document as it becomes avail-

able.

Absolute maximum ratings for the dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, and dsPIC33FJ128GPX02/X04

family are listed below. Exposure to these maximum rating conditions for extended periods can affect device reliability.

Functional operation of the device at these or any other conditions above the parameters indicated in the operation list-

ings of this specification is not implied.

Absolute Maximum Ratings(1)

Ambient temperature under bias............................................................................................................ .-40°C to +125°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Voltage on any pin that is not 5V tolerant with respect to VSS(4) .................................................... -0.3V to (VDD + 0.3V)

Voltage on any 5V tolerant pin with respect to VSS when VDD

 3.0V(4) .................................................. -0.3V to +5.6V

Voltage on any 5V tolerant pin with respect to Vss when VDD < 3.0V(4)......................................... -0.3V to (VDD + 0.3V)

Voltage on VCAP/VDDCORE with respect to VSS ....................................................................................... 2.25V to 2.75V

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin(2)........................................................................................................................... 250 mA

Maximum output current sunk by any I/O pin(3) ........................................................................................................ 4 mA

Maximum output current sourced by any I/O pin(3)................................................................................................... 4 mA

Maximum current sunk by all ports ....................................................................................................................... 200 mA

Maximum current sourced by all ports(2)............................................................................................................... 200 mA

Note 1: Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the

device. This is a stress rating only, and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods can affect device reliability.

2: Maximum allowable current is a function of device maximum power dissipation (see Table 30-2).

3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx

and PGEDx pins, which are able to sink/source 12 mA.

4: See the “Pin Diagrams” section for 5V tolerant pins.

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