DSPIC33FJ32GP302THSLASHSP datasheet(322/403 Pages) MICROCHIP

322 / 403 page

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04

DS70292D-page 322

Preliminary

 2009 Microchip Technology Inc.

30.1

DC Characteristics

TABLE 30-1:

OPERATING MIPS VS. VOLTAGE

Characteristic

VDD Range

(in Volts)

Temp Range

(in °C)

Max MIPS

dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04, and

dsPIC33FJ128GPX02/X04

3.0-3.6V

-40°C to +85°C

3.0-3.6V

-40°C to +125°C

TABLE 30-2:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

Industrial Temperature Devices

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

Extended Temperature Devices

Operating Junction Temperature Range

-40

—

+140

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD –

 IOH)

PINT + PI/O

I/O Pin Power Dissipation:

I/O =

 ({VDD – VOH} x IOH) +  (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/

JA

TABLE 30-3:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 44-pin QFN

JA

—

°C/W

Package Thermal Resistance, 44-pin TFQP

JA

—

°C/W

Package Thermal Resistance, 28-pin SPDIP

JA

—

°C/W

Package Thermal Resistance, 28-pin SOIC

JA

—

°C/W

Package Thermal Resistance, 28-pin QFN-S

JA

—

°C/W

Note 1:

Junction to ambient thermal resistance, Theta-JA (

JA) numbers are achieved by package simulations.

DSPIC33FJ32GP302TH/SP Datasheet(PDF) 322 Page - Microchip Technology

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