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DSPIC33FJ32GP302TH/SP Datasheet(PDF) 326 Page - Microchip Technology |
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DSPIC33FJ32GP302TH/SP Datasheet(HTML) 326 Page - Microchip Technology |
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326 / 403 page ![]() dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04 DS70292D-page 326 Preliminary 2009 Microchip Technology Inc. TABLE 30-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD) DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Parameter No. Typical(1) Max Units Conditions Power-Down Current (IPD)(2) DC60d 24 500 A-40°C 3.3V Base Power-Down Current(3,4) DC60a 28 500 A+25°C DC60b 124 750 A+85°C DC60c 350 1000 A +125°C DC61d 8 13 A-40°C 3.3V Watchdog Timer Current: IWDT(3) DC61a 10 15 A+25°C DC61b 12 20 A+85°C DC61c 13 25 A +125°C Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated. 2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and pulled to VSS. WDT, etc., are all switched off and VREGS (RCON<8>) = 1. 3: The current is the additional current consumed when the module is enabled. This current should be added to the base IPD current. 4: These currents are measured on the device containing the most memory in this family. TABLE 30-8: DC CHARACTERISTICS: DOZE CURRENT (IDOZE) DC CHARACTERISTICS Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated) Operating temperature -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Parameter No. Typical(1) Max Doze Ratio Units Conditions DC73a 42 50 1:2 mA -40°C 3.3V 40 MIPS DC73f 23 30 1:64 mA DC73g 23 30 1:128 mA DC70a 42 50 1:2 mA +25°C 3.3V 40 MIPS DC70f 26 30 1:64 mA DC70g 25 30 1:128 mA DC71a 41 50 1:2 mA +85°C 3.3V 40 MIPS DC71f 25 30 1:64 mA DC71g 24 30 1:128 mA DC72a 42 50 1:2 mA +125°C 3.3V 40 MIPS DC72f 26 30 1:64 mA DC72g 25 30 1:128 mA Note 1: Data in the Typical column is at 3.3V, 25°C unless otherwise stated. |
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