TL1454, TL1454Y

DUAL-CHANNEL PULSE-WIDTH-MODULATION (PWM)

CONTROL CIRCUIT

SLVS086B – APRIL 1995 – REVISED NOVEMBER 1997

3

POST OFFICE BOX 655303

POST OFFICE BOX 1443

TL1454Y chip information

This chip, when properly assembled, displays characteristics similar to the TL1454C. Thermal compression or

ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

TL1454Y

(2)

(14)

(1)

(3)

(4)

(5)

(6)

(7)

(8)

(16)

(13)

(12)

(11)

(10)

(9)

REF

DTC2

IN2+

IN2 –

COMP2

VCC

OUT2

OUT1

COMP1

IN1–

IN1 +

RT

CT

GND

86

108

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(10)

(11)

(12)

(13)

(14)

(15)

(16)

(8)

(9)

(15)

SCP

DTC1