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APA3160 Datasheet(PDF) 2 Page - Anpec Electronics Coropration |
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APA3160 Datasheet(HTML) 2 Page - Anpec Electronics Coropration |
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2 / 44 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.4 - Jan., 2013 www.anpec.com.tw 2 APA3160 Symbol Parameter Rating Unit Supply Voltage (PVDD_X to PGND_XX) -0.3 to 26 Supply Voltage (DVDD to DVSS) -0.3 to 3.6 Supply Voltage (AVDD to AVSS) -0.3 to 3.6 Input Voltage (MCLK to AVSS) -0.5 to AVDD+2.5 Input Voltage (SD, RST, LRCLK, SCLK, SDIN, SDA, SCL to DVSS) -0.5 to DVDD+2.5 Input Voltage (OUT_X to PGND_XX) -0.3 to +32 Input Voltage (XBS to PGND_XX) -0.3 to +43 Input Voltage (AVSS, DVSS, AGND to PGND_XX) -0.3 to +0.3 V TJ Maximum Junction Temperature 150 οC TSTG Storage Temperature Range -65 to +150 οC TSDR Soldering Temperature Range, 10 seconds 260 οC PD Power Dissipation Internally Limited W Ordering and Marking Information Absolute Maximum Ratings (Note 1) Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). APA3160 Handling Code Temperature Range Package Code Package Code QCA : TQFP7x7-48P Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APA3160 QCA : APA3160 XXXXX XXXXX - Date Code Assembly Material Symbol Parameter Typical Value Unit θ JA Junction-to-Ambient Resistance in Free Air (Note 2) TQFP7x7-48P 25 °C/W θ JC Junction-to-Case Resistance in Free Air (Note 3) TQFP7x7-48P - °C/W Thermal Characteristics Note 2: θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad of TQFP7X7-48P is soldered directly on the PCB. Note 3: The case temperature is measured at the center of the exposed pad on the underside of the TQFP7X7-48P package. |
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