APT5014BLLG datasheet(18/44 Pages) MICROSEMI

18 / 44 page

Packaging

SOT-227

SP4

SP3

SP6-P

SP1

Industry Standard Packages

Improved Low Proﬁle Packages

SP1 (12mm)

SP3 (12mm)

SP4 (17mm)

SP6 (17mm)

SP6-P (12mm)

SOT-227 (Isotop®)

SP2 (17mm)

34mm & 62mm Types

D1 (34 mm Wide)

D3 (62 mm Wide)

D4 (62 mm Wide)

ISOTOP ®

SP6 - APT MODULE

12 mm

SP module

Package Advantages

SP6-P package:

-Replaces up to 6 SOT-227 parts

-Height compatible with SOT-227

-Low inductance solder pins

-High current capability

30 mm

17 mm

SP6 package:

Offers the same footprint and the same

pinout location as the popular 62mm

package but with lower height, leading to:

- Reduced stray inductance

- Reduced parasitic resistance

- Higher efﬁciency at high frequency

SP1 package:

-Replaces 2 SOT-227 parts

-Improved assembly time and cost

-Height compatible with SOT-227

-Copper base plate

SD1

SD2

Twin Tower

9-pin TO-249

TO-249

Mini-Mod

Surface Mount

Half Pack

SP3F

SM3

SM2

SM1

SM5

SF1

SM4

SM2-1

SM3-1

SP2

SP6

17 mm

SP3F package:

-Replaces up to 4 SOT-227 parts

-Reduced assembly time and cost

-Height compatible with SOT-227

-Copper base plate

APT5014BLLG Datasheet(PDF) 18 Page - Microsemi Corporation

APT5014BLLG Datasheet(HTML) 18 Page - Microsemi Corporation

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