 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
APT5014BLLG Datasheet(PDF) 20 Page - Microsemi Corporation |
|
|
|||||||||||||||||||||||||||||
APT5014BLLG Datasheet(HTML) 20 Page - Microsemi Corporation |
|
|
20 / 44 page  20 Rugged Custom Power Modules Microsemi PMP has acquired a great experience and know-how in module customization to address rugged and wide temperature range application and offers solution to meet with next generation integrated power systems expectation in terms of: Applications Test Capabilities Reliability Testing Capabilities Expertise Capabilities All tests can be conducted upon demand by sampling or at 100%. Tests performed in house or with external lab. Our Core Competencies harsh environments analysis Industrial Application Extended Temperature Application Harsh Environment Application Standard Module X No NRE Low Volume Entry Modified Standard XX Low NRE Low Volume Entry Custom Module XXX Medium to High NRE Low Volume Entry Various solutions are proposed offering different cost and low volume of entry: Dice Solder Joint Material CTE Thermal Density (ppm/K) conductivity (g/cc) (W/m.K) Base plate CuW 6.5 190 17 AlSiC 7 170 2.9 Cu 17 390 8.9 Substrate Al 2O3 7 25 - AlN 5 170 - Si 3N4 3 60 - Die Si 4 136 - SiC 2.6 270 - CTE Thermal Rthjc (ppm/K) conductivity (K/W) (W/m.K) Silicon Die (120 mm2) 4 136 Cu/Al 2O3 17/7 390/25 0.35 AlSiC/Al 2O3 7/7 170/25 0.38 Cu/AlN 17/5 390/170 0.28 AlSiC/AlN 7/5 170/170 0.31 AlSiC/Si 3N4 7/3 170/60 0.31 DBC Substrate Solder Joint Base Plate More closely matched materials TCE’s increase the module life time because it will result in much less stress at the interface of the materials and inside the materials. The higher the thermal conductivity, the lower is the junction to case thermal resistance and the lower will be the delta of junction temperature of the device during operation such that the effect of power cycling on the dice will be minimized. Another important feature is the material density particularly for the baseplate. Taking copper as the reference, Alsic has a density of 1/3 while Cuw has twice the density. Therefore AlSiC will provide substantial weight reduction at the same time as reliability increase. Module performance and reliability depends on the choice of the assembly materials |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
