MP28253EL datasheet(2/15 Pages) MPS

2 / 15 page

MP28253 – 3A, 21V, SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS

MP28253 Rev. 1.02

www.MonolithicPower.com

12/25/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP28253EL

3x4 QFN14

28253

-20

°C to +85°C

For Tape & Reel, add suffix –Z (e.g. MP28253EL–Z).

For RoHS compliant packaging, add suffix –LF (e.g. MP28253EL–LF–Z)

PACKAGE REFERENCE

PIN 1 ID

AGND

GND

VCC

BST

EN/SYNC

TOP VIEW

EXPOSED PAD

ON BACKSIDE

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage VIN ....................................... 22V

VSW..........................-0.3V (-5V for<10ns) to 23V

VBS ....................................................... VSW + 6V

All Other Pins............................. -0.3V to +6V

(2)

Operating Temperature.............. -20

°C to +85°C

Continuous Power Dissipation (TA = +25°C)

(3)

……………………………………………....2.6W

Junction Temperature...............................150

°C

Lead Temperature ....................................260

°C

Storage Temperature............... -65

°C to +150°C

Recommended Operating Conditions

(4)

Supply Voltage VIN ...........................4.5V to 21V

Maximum Junction Temp. (TJ) ...............+125°C

Thermal Resistance

(5)

θJA

θJC

3x4 QFN14 ............................. 48 ...... 11...

°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) Please refer to Page 9, Enable Control Section for absolute

maximum rating of EN pin.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

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