ZSSC3036

Low-Power 16-Bit Sensor Signal Conditioner IC

Data Sheet

May 28, 2013

© 2013 Zentrum Mikroelektronik Dresden AG

— Rev. 1.20

All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

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Table 2.2

Amplifier Gain: Stage 2 ..................................................................................................................13

Table 2.3

Gain Polarity ..................................................................................................................................13

Table 2.4

MSB/LSB Segmentation Settings for Bridge Measurement ..........................................................14

Table 2.5

MSB/LSB Segmentation Settings for Temperature Measurement ................................................14

Table 2.6

ADC Conversion Times for a Single A2D Conversion...................................................................15

Table 2.7

Typical Conversion Times vs. Noise Performance for 16-Bit Results with Full Sensor Signal

Conditioning for AZBM, BM, AZTM, and TM .................................................................................16

Table 2.8

ADC Offset Settings.......................................................................................................................17

Table 3.1

SPI/I

2C™ Commands ....................................................................................................................24

Table 3.2

Get_Raw Commands ....................................................................................................................25

Table 3.3

General Status Byte.......................................................................................................................26

Table 3.4

Status Byte for Read Operations ...................................................................................................26

Table 3.5

Status Byte for Write Operations ...................................................................................................26

Table 3.6

Mode Status...................................................................................................................................27

Table 3.7

Memory Status Word .....................................................................................................................32

Table 3.8

MTP Memory Content Assignments ..............................................................................................33

Table 4.1

Die Size & Geometry .....................................................................................................................46

Table 4.2

Pin Assignments ............................................................................................................................46