W25Q16CVZPIP datasheet(2/81 Pages) WINBOND

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W25Q16CV

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Table of Contents

GENERAL DESCRIPTION ............................................................................................................... 5

FEATURES....................................................................................................................................... 5

PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6

3.1

Pin Configuration SOIC / VSOP 150 / 208-mil ..................................................................... 6

3.2

Pad Configuration WSON 6x5-mm ...................................................................................... 6

3.3

Pin Configuration PDIP 300-mil............................................................................................ 7

3.4

Pin Description SOIC / VSOP 150/208-mil, WSON 6x5-mm & PDIP 300-mil ..................... 7

3.5

Pin Configuration SOIC 300-mil ........................................................................................... 8

3.6

Pin Description SOIC 300-mil............................................................................................... 8

3.7

Ball Configuration TFBGA 8x6-mm ...................................................................................... 9

3.8

Ball Description TFBGA 8x6-mm ......................................................................................... 9

PIN DESCRIPTIONS...................................................................................................................... 10

4.1

Chip Select (/CS)................................................................................................................ 10

4.2

Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 10

4.3

Write Protect (/WP)............................................................................................................. 10

4.4

HOLD (/HOLD) ................................................................................................................... 10

4.5

Serial Clock (CLK) .............................................................................................................. 10

BLOCK DIAGRAM .......................................................................................................................... 11

FUNCTIONAL DESCRIPTION ....................................................................................................... 12

6.1

SPI OPERATIONS ............................................................................................................. 12

6.1.1

Standard SPI Instructions.....................................................................................................12

6.1.2

Dual SPI Instructions ............................................................................................................12

6.1.3

Qu3ad SPI Instructions ........................................................................................................12

6.1.4

Hold Function .......................................................................................................................12

6.2

WRITE PROTECTION ....................................................................................................... 13

6.2.1

Write Protect Features .........................................................................................................13

STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 14

7.1

STATUS REGISTERS........................................................................................................ 14

7.1.1

BUSY Status (BUSY) ...........................................................................................................14

7.1.2

Write Enable Latch Status (WEL).........................................................................................14

7.1.3

Block Protect Bits (BP2, BP1, BP0)......................................................................................14

7.1.4

Top/Bottom Block Protect Bit (TB)........................................................................................14

7.1.5

Sector/Block Protect Bit (SEC) .............................................................................................14

7.1.6

Complement Protect Bit (CMP) ............................................................................................15

7.1.7

Status Register Protect Bits (SRP1, SRP0)..........................................................................15

7.1.8

Erase/Program Suspend Status (SUS) ................................................................................15

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