THS4281

SLOS432A – APRIL 2004 – REVISED NOVEMBER 2009

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

UNIT

16.5 V

±2 V

±100 mA

Continuous power dissipation

See Dissipation Ratings Table

+150°C

+125°C

–65°C to +150°C

HBM

3500 V

ESD ratings

CDM

1500 V

MM

100 V

(1)

The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may

cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(2)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device. recommended operating conditions.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Dual supply

±1.35

±8.25

V

Single supply

2.7

16.5

DISSIPATION RATINGS TABLE PER PACKAGE

(1)

PACKAGE

(°C/W)

(°C/W)

DBV (5)

55

255.4

391 mW

156 mW

D (8)

38.3

97.5

1.02 W

410 mW

DGK (8)

71.5

180.8

553 mW

221 mW

(1)

This data was taken using the JEDEC standard High-K test PCB.

(2)

Power rating is determined with a junction temperature of +125°C. This is the point where distortion starts to substantially increase.

Thermal management of the final PCB should strive to keep the junction temperature at or below +125°C for best performance and long

term reliability.

2

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