L5150CJ / L5150CS

Package and PCB thermal data

Doc ID 15542 Rev. 15

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4

Package and PCB thermal data

4.1

PowerSSO-12 thermal data

Figure 26.

PowerSSO-12 PC board(1)

1.

FR4 area = 77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and back side),

thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm,

footprint dimension 4.1 mm x 6.5 mm ).

Figure 27.