MA4SW424B-1

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

6

SP4T 24GHz PIN Diode Switch with Integrated Bias Network

Rev. V1

Part Number

Packaging

MA4SW424B-1

Die in Waffle Pack

Cleanliness

These chips should be handled in a clean environment free of organic contamination.

Electro-Static Sensitivity

The MA4SW424B-1 PIN diode switch is ESD, Class 1A sensitive (HBM). The proper ESD handling procedures

must be followed.

Wire Bonding

Thermo-compression wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is

energy is necessary, it should be adjusted to the minimum level required to achieve a good bond. RF bond wires

should be kept as short as possible.

Chip Mounting

The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with conductive silver epoxy. Mounting

surface must be clean and flat. A minimum amount of epoxy, 1-2 mils thick, should be used to attach chip. A thin

epoxy fillet should be visible around the outer perimeter of the chip after placement. Cure epoxy per product

instructions. Typically 150°C for 1 hour.

Assembly Considerations

Ordering Information