| Electronic Components Datasheet Search |
|
MA4SW424B-1 Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
|
|
|||||||||||||||||||||||||||||
MA4SW424B-1 Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
|
1 / 6 page ![]() MA4SW424B-1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 1 SP4T 24GHz PIN Diode Switch with Integrated Bias Network Rev. V1 Features ♦Frequency of Operation: 24 +/- 2 GHz ♦Fully Integrated Bias Network ♦Low Power Consumption +12mA for Insertion Loss, 0V for Isolation ♦The Device is Wire Bond Compensated at all RF Ports for RF Matching ♦Rugged, Monolithic, Glass Encapsulated Construction ♦RoHS Compliant Absolute Maximum Ratings 1 1. Exceeding any of these limits may cause permanent damage to the chip. The MA4SW424B-1 is a SP4T switch with an integrated bias network which utilizes M/A-COM Technology Solutions HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and/or shunt diodes or vias by imbedding them in a low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices exceptional low loss and high isolation performance with exceptional repeatability through lower millimeter frequencies. Five, 4.5 X 5.5 mil, RF bond pads facilitate the use of low inductance ribbon bonds, while gold backside metallization allows for manual or automatic chip bonding using electrically conductive silver epoxy. Each RF bond pad has an adjacent tuning pad. The user can use bias and add the appropriate wire or ribbon (inductance) to optimize the RF match and performance for the particular frequency of interest. Description Applications The MA4SW424B-1 SP4T, switch is designed for 24 GHz automotive switching applications. Insertion loss is achieved with +12 mA @ +4 V and isolation is achieved with 0V D.C. bias. The RF bias network is integrated into the HMIC switch for ease of use and space considerations . Parameter Absolute Maximum Forward Current +40mA Operating Temperature -55°C to +125°C Storage Temperature -55°C to +150°C Junction Temperature +175°C RF Incident Power @ +20mA 30 dBm Gold bond pads are shown here in yellow. |
Similar Part No. - MA4SW424B-1 |
|
Similar Description - MA4SW424B-1 |
|
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |