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MAX20021 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX20021
Description  Step-Down DC-DC Converters
PDF  16 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX20021 Datasheet(HTML) 2 Page - Maxim Integrated Products

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MAX20021/MAX20022
Automotive Quad, Low-Voltage
Step-Down DC-DC Converters
www.maximintegrated.com
Maxim Integrated │ 2
Electrical Characteristics
(VA = VPV1 = VPV2 = VPV3 = VPV4 = 5.0V; TA = TJ = -40ºC to +125ºC, unless otherwise noted. Typical values are at TA = +25ºC under
normal conditions, unless otherwise noted.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
PV_ to PGND_ .....................................................-0.3V to +6.0V
VA to GND............................................................-0.3V to +6.0V
OUTS_, EN_, PG_, SYNC, SEL to GND ......-0.3V to VA + 0.3V
PV_ to PV_...........................................................-0.3V to +0.3V
PGND_ to GND....................................................-0.3V to +0.3V
LX_ to PGND...............................................-1.0V to PV_ + 0.3V
LX_ Continuous RMS Current..............................................2.0A
Output Short-Circuit Duration....................................Continuous
Continuous Power Dissipation (TA = +70ºC)
TQFN (derate 28.6mW/ºC above +70ºC)..................2285mW
ESDHB.................................................................................±2kV
ESDMM..............................................................................±200V
Operating Temperature Range..........................-40ºC to +125ºC
Junction Temperature......................................................+150ºC
Storage Temperature Range.............................-65ºC to +150ºC
Lead Temperature (soldering, 10s) ................................. +300ºC
Soldering Temperature (reflow)....................................... +260ºC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-AmbientThermalResistance(θJA) ..............35°C/W
Junction-to-CaseThermalResistance(θJC).....................3°C/W
Absolute Maximum Ratings
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNIT
GENERAL
Supply Voltage Range
VPV_
Fully operational
3.0
5.5
V
Supply Current
IPV0
No load, no switching,
VEN1 = VEN2 = VEN3 = VEN4 = VPV_
2.5
3.8
5
mA
Shut-Off Current
IVPSD
VEN1 = VEN2 = VEN3 =
VEN4 = VGND
TA = +25°C
0.1
2
µA
TA = +125°C
2
Overvoltage Threshold
Rising
5.6
5.8
6
V
Hysteresis
0.1
Undervoltage Monitor Threshold
UVM option enabled
VPV_ falling
4.15
4.3
4.45
V
VPV_ hysteresis
0.1
UVLO Threshold
VPV_ falling
2.68
V
VPV_ rising
3.0
PWM Switching Frequency
fSW
Switching frequency = 2.2MHz
(see the Selector Guide
)
2.0
2.2
2.4
MHz
Switching frequency = 3.2MHz
(see the Selector Guide)
3.0
3.2
3.4
Spread Spectrum
Df/f
Spread-spectrum option = enabled
(see the Selector Guide)
+3
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