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DA28F016SV-080 Datasheet(PDF) 9 Page - Intel Corporation |
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DA28F016SV-080 Datasheet(HTML) 9 Page - Intel Corporation |
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9 / 63 page ![]() E 28F016SV FlashFile™ MEMORY 9 order address and address A0 is not used (don’t care). A device block diagram is shown in Figure 1. The 28F016SV is specified for a maximum access time of 65 ns (tACC) at 5V operation (4.75V to 5.25V) over the commercial temperature range (0 °C to +70°C). A corresponding maximum access time of 75 ns at 3.3V (3.0V to 3.6V and 0 °C to +70 °C) is achieved for reduced power consumption applications. The 28F016SV incorporates an Automatic Power Saving (APS) feature, which substantially reduces the active current when the device is in static mode of operation (addresses not switching). In APS mode, the typical ICC current is 1 mA at 5V (3.0 mA at 3.3V). A deep power-down mode of operation is invoked when the RP# (called PWD# on the 28F008SA) pin transitions low. This mode brings the device power consumption to less than 2.0 µA, typically, and provides additional program protection by acting as a device reset pin during power transitions. A reset time of 400 ns (5V VCC operation) is required from RP# switching high until outputs are again valid. In the Deep Power- Down state, the WSM is reset (any current operation will abort) and the CSR, GSR and BSR registers are cleared. A CMOS standby mode of operation is enabled when either CE0# or CE1# transitions high and RP# stays high with all input control pins at CMOS levels. In this mode, the device typically draws an ICC standby current of 70 µA at 5V VCC. The 28F016SV will be available in 56-lead, 1.2 mm thick, 14 mm x 20 mm TSOP and 56-lead, 1.8 mm thick, 16 mm x 23.7 SSOP Type I packages. The form factor and pinout of these two packages allow for very high board layout densities. 2.0 DEVICE PINOUT The 28F016SV 56-lead TSOP and 56-lead SSOP Type I pinout configurations are shown in Figures 2 and 3. |
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