Packing specifications and labeling description

TN1200

4/16

DocID027277 Rev 1

Figure 3. Flip Chip marking example (only for Si and HRSi)

• “Dot” used for die thickness > 200 µm

• “LL” used for die thickness < 200 µm

3

Packing specifications and labeling description

Flip Chips are delivered in tape and reel to be fully compatible with standard high volume

SMD components. The features of tape and reel materials are in accordance with

EIA-481-D, IEC 60286-3 and EIA 763 (783) standards. All features not specified in this

section are in accordance with EIA-481-D, IEC 60286-3 and EIA 763 (783) standards.

3.1

Carrier tape

Flip Chips are placed in the carrier tape with their bump side facing the bottom of the cavity

so that the components can be picked-up by their flat side. No flipping of the package is

necessary for mounting on PCB. The products are positioned in the carrier tape with pin A1

on the sprocket hole side. Carrier tape mechanical dimensions are shown in the example in

Figure 4. Standard tape width is 8 mm for die sizes smaller than 3 mm (dimension B0).

Figure 4. Carrier tape example

A1 bump location may vary with product layout

Cavity

has center hole

at the bottom

Dot identifying Pin A1 location

User direction of unreeling

All dimensions are typical values in mm

4.0

2.0

2.0

Ø 1.55

0.46

0.67

0.2

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