AN2994 datasheet(29/38 Pages) STMICROELECTRONICS

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AN2994

Thermal measures

Doc ID 15796 Rev 2

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Thermal measures

To verify the reliability of the design, a thermal mapping by means of an IR camera has been

done. Figure 38 and Figure 39 show the thermal measurements on the board component

side at nominal input voltages and full load. Pointers (visible on the images) placed across

the key components show the relevant temperature. Table 1 provides the correlation

between the measured points and the components, for both thermal maps. The ambient

temperature during both measurements was 27°C. According to the results obtained, all the

board components are operating within their temperature limits.

Figure 38.

Thermal map at 115 Vac, 60 Hz - full load

Figure 39.

Thermal map at 230 Vac, 50 Hz - full load

Table 1.

Measured temperature at 115 Vac and 230 Vac - full load

Point

Component

Temperature at 115 Vac

Temperature at 230 Vac

57.3 °C

42.3 °C

62.2 °C

48.6 °C

62.4 °C

48.3 °C

60.2 °C

47.8 °C

38.2 °C

35.4 °C

53.4 °C

37.2 °C

55.1 °C

40.1 °C

L4 – CORE

61.8 °C

49.3 °C

L4 – WINDING

68.7 °C

52.8 °C

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