Risks of ESD

AN3960

8/21

Doc ID 022082 Rev 1

Figure 2.

2.2.4

MIL-STD-883H

This standard method classifies microcircuits according to their susceptibility to damage or

suited for electronic device tests as ESD stress can be applied directly onto its pins.

2.2.5

ESD standard summary

An application has to align with one or more standards as agreed with the customer. Table 1

summarizes the test conditions for the ESD standards.

When an ESD event occurs, the standards outlined in Section 2.2 describe four test results

which can occur in a real application.

120

100

80

60

53

40

27

20

0

-10

0

10

20

30

40

506070

80

90

100

Time (ns)

Rise time = 0.7 ns to 1 ns

ai18793

Table 1.

Test conditions for ESD standards

Standard

Model

JS-001-2010

HBM

1.5 k

Ω

100 pF

8 kV

SP723 EIAJ IC121

MM

0

Ω

200 pF

2 kV

IEC61000-4-2

1.

Level 4 = maximum level of test voltage in the IEC61000-4-2 standard.

HBM and air discharge

330

Ω

150 pF

15 kV

HBM, and direct discharge

330

Ω

150 pF

8 kV

2.

Class 3B = maximum level of test voltage in the MIL-STD-883H standard.

HBM

1.5 k

Ω

100 pF

8 kV