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RF5632 Datasheet(PDF) 6 Page - RF Micro Devices |
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RF5632 Datasheet(HTML) 6 Page - RF Micro Devices |
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6 / 18 page ![]() 6 of 18 RF5632 DS120213 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Package Drawing Thermal vias for center slug “C” should be incorporated into the PCB design. The number and size of thermal vias will depend on the application, the power dissipation, and the electrical requirements. Example of the num- ber and size of vias can be found on the RFMD evaluation board layout. 4.000± 0.1 4.000± 0.1 0.850±0.05 #1 2 3 4 5 6 18 17 16 15 14 13 7 8 9 10 11 12 22 24 23 21 20 19 2.700±0.100 2.700±0.100 0.500 BSC 0.230±0.050 0.350±0.050 0.287±0.05 0.203±0.050 0.030 PCB METAL LAND PATTERN PCB SOLDER MASK PATTERN PCB STENCIL PATTERN 10x 0.270 10x 0.293 12x 0.377 12x 0.377 6x 1.793 2x 1.250 2x 0.750 2x 0.250 0.000 2x 0.250 2x 0.750 2x 1.250 6x 1.793 10x 0.270 10x 0.270 12x 0.300 12x 0.300 6x 1.793 2x 1.250 2x 0.750 2x 0.250 0.000 2x 0.250 2x 0.750 2x 1.250 6x 1.793 10x 0.120 10x 0.120 12x 0.150 12x 0.150 6x 1.793 2x 1.250 2x 0.750 2x 0.250 0.000 2x 0.250 2x 0.750 2x 1.250 6x 1.793 2x 0.325 2x 0.325 2x 0.725 2x 0.725 |
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