Revision DS20150609

Disclaimer: Subject to change without notice

© 2015 RF Micro Devices, Inc.

www.rfmd.com / www.qorvo.com

10 of 10

RFPA2172

RFMD + TriQuint = Qorvo

Pin Names and Descriptions

Pin

Name

Description

Interface Schematic

1

GND

Ground connection. For best performance, keep traces

physically short and connect immediately to the ground plane.

2

GND

Ground connection for the driver stage. For best performance,

keep traces physically short and connect immediately to the

ground plane.

3

RF IN

RF input. This is a 50Ω input. No external matching is

needed. An external DC blocking capacitor is required if this

port is connected to a DC path to ground or a DC voltage.

See pin 15

4

GND

See pin 1.

5

GND

See pin 1.

6

VPD

Power down pin. When this pin is OV, the device will be in

power down mode, dissipating minimum DC power. This pin

should be at the supply voltage when the part is not in power

down mode.

7

APC

Analog power control. Output power varies as a function of the

voltage on this pin. See graph. This pin must be driven

through a series resistor with a voltage between OV and VCC.

Series resistor determines dynamic range of power control.

Resistor”.

APC

Bias

Network

RF IN

1st

Stage

8

GND

See pin 1.

9

GND

See pin 1.

10

GND

See pin 1.

11

RF OUT

RF output. An external matching network is required to

provide the optimum load impedance at this pin.

See pin 15

12

RF OUT

RF output and power supply for the output stage. Bias voltage

for the output stage is provided through this pin. A shunt cap

used at this pin to provide a second harmonic trap.

See pin 15

13

GND

See pin 1.

14

GND

See pin 1.

15

VCC

Power supply for driver stage and interstage matching. This

pin forms the shunt inductance needed for proper tuning of

the interstage. Refer to the application schematic for the

proper configuration. Note: Position and value of the

components are important.

GND

External Cap

Inductor

Bond

Wire

Pin 15

RF OUT

1st Stage

2nd Stage

RF IN

RF OUT

16

GND

See pin 1.

Pkg Base

GND

Ground connection for the output stage. This pad should be

connected to the groundplane by vias directly under the

device. A short path is required to obtain optimum

performance, as well as provide a good thermal path to the

PCB for maximum heat dissipation.