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RFPA2172 Datasheet(PDF) 8 Page - RF Micro Devices |
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RFPA2172 Datasheet(HTML) 8 Page - RF Micro Devices |
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8 / 10 page ![]() Revision DS20150609 Disclaimer: Subject to change without notice © 2015 RF Micro Devices, Inc. www.rfmd.com / www.qorvo.com 8 of 10 RFPA2172 RFMD + TriQuint = Qorvo PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3 µinch to 8 µinch gold over 180µinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern Figure 1. PCB Metal Land Pattern (Top View) |
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