| Electronic Components Datasheet Search |
|
MAX197ACAI Datasheet(PDF) 15 Page - Maxim Integrated Products |
|
|
|||||||||||||||||||||||||||||
MAX197ACAI Datasheet(HTML) 15 Page - Maxim Integrated Products |
|
15 / 16 page ![]() Transfer Function Output data coding for the MAX197 is binary in unipo- lar mode with 1LSB = (FS / 4096) and twos-comple- ment binary in bipolar mode with 1LSB = ((2 x |FS|) / 4096). Code transitions occur halfway between succes- sive-integer LSB values. Figures 10 and 11 show the input/output (I/O) transfer functions for unipolar and bipolar operations, respectively. For full-scale (FS) val- ues, refer to Table 1. Layout, Grounding, and Bypassing Careful printed circuit board layout is essential for best system performance. For best performance, use a ground plane. To reduce crosstalk and noise injection, keep analog and digital signals separate. Digital ground lines can run between digital signal lines to minimize interference. Connect analog grounds and DGND in a star configuration to AGND. For noise-free operation, ensure the ground return from AGND to the supply ground is low impedance and as short as possi- ble. Connect the logic grounds directly to the supply ground. Bypass VDD with 0.1µF and 4.7µF capacitors to AGND to minimize high- and low-frequency fluctua- tions. If the supply is excessively noisy, connect a 5 Ω resistor between the supply and VDD, as shown in Figure 12. Multi-Range (±10V, ±5V, +10V, +5V), Single +5V, 12-Bit DAS with 8+4 Bus Interface ______________________________________________________________________________________ 15 _Ordering Information (continued) 28 Narrow Ceramic SB** -55°C to +125°C MAX197BMYI 28 Narrow Ceramic SB** -55°C to +125°C MAX197AMYI 28 SSOP -40°C to +85°C MAX197BEAI 28 SSOP -40°C to +85°C MAX197AEAI 28 Wide SO -40°C to +85°C MAX197BEWI 28 Wide SO 28 Narrow Plastic DIP 28 Narrow Plastic DIP -40°C to +85°C -40°C to +85°C -40°C to +85°C MAX197AEWI MAX197BENI MAX197AENI PIN-PACKAGE TEMP. RANGE PART VDD GND DGND DGND AGND +5V +5V SUPPLY R* = 5 Ω DIGITAL CIRCUITRY 4.7 µF 0.1 µF MAX197 ** * OPTIONAL ** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE Figure 12. Power-Supply Grounding Connection TRANSISTOR COUNT: 2956 SUBSTRATE CONNECTED TO GND ___________________Chip Topography CH5 CH6 CH7 INT REFADJ 0.231" (5.870mm) 0.144" (3.659mm) D2 CH0 CH1 D0 D1 AGND CH4 CH3 CH2 VCC VDD REF DGND CLK WR CS RD HBEN SHDN D7 D6 D5 D4 D3 ** Contact factory for availability and processing to MIL-STD-883. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |