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MAX199ACAI Datasheet(PDF) 15 Page - Maxim Integrated Products |
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MAX199ACAI Datasheet(HTML) 15 Page - Maxim Integrated Products |
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15 / 16 page ![]() Transfer Function Output data coding for the MAX199 is binary in unipolar mode with 1LSB = (FS / 4096) and twos-complement binary in bipolar mode with 1LSB = [(2 x |FS|) / 4096]. Code transitions occur halfway between successive- integer LSB values. Figures 10 and 11 show the input/output (I/O) transfer functions for unipolar and bipolar operations, respectively. Layout, Grounding, and Bypassing Careful printed circuit board layout is essential for best system performance. For best performance, use a ground plane. To reduce crosstalk and noise injection, keep analog and digital signals separate. Digital ground lines can run between digital signal lines to minimize interference. Connect analog grounds and DGND in a star configuration to AGND. For noise-free operation, ensure the ground return from AGND to the supply ground is low impedance and as short as possi- ble. Connect the logic grounds directly to the supply ground. Bypass VDD with 0.1µF and 4.7µF capacitors to AGND to minimize high- and low-frequency fluctua- tions. If the supply is excessively noisy, connect a 5 Ω resistor between the supply and VDD, as shown in Figure 12. Multi-Range (±4V, ±2V, +4V, +2V), +5V Supply, 12-Bit DAS with 8+4 Bus Interface ______________________________________________________________________________________ 15 _Ordering Information (continued) 28 Narrow Ceramic SB** -55°C to +125°C MAX199BMYI 28 Narrow Ceramic SB** -55°C to +125°C MAX199AMYI 28 SSOP -40°C to +85°C MAX199BEAI 28 SSOP -40°C to +85°C MAX199AEAI 28 Wide SO -40°C to +85°C MAX199BEWI 28 Wide SO 28 Narrow Plastic DIP 28 Narrow Plastic DIP -40°C to +85°C -40°C to +85°C -40°C to +85°C MAX199AEWI MAX199BENI MAX199AENI PIN-PACKAGE TEMP. RANGE PART VDD GND DGND DGND AGND +5V +5V SUPPLY R* = 5 Ω DIGITAL CIRCUITRY 4.7 µF 0.1 µF MAX199 ** * OPTIONAL ** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE Figure 12. Power-Supply Grounding Connection TRANSISTOR COUNT: 2956 SUBSTRATE CONNECTED TO GND ___________________Chip Topography CH5 CH6 CH7 INT REFADJ 0.231" (5.870mm) 0.144" (3.659mm) D2 CH0 CH1 D0 D1 AGND CH4 CH3 CH2 VCC VDD REF DGND CLK WR CS RD HBEN SHDN D7 D6 D5 D4 D3 ** Contact factory for availability and processing to MIL-STD-883. |
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