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TC1307 Datasheet(PDF) 4 Page - Microchip Technology

Part # TC1307
Description  Four-Channel CMOS LDO with Select Mode, Shutdown and Independent Reset
PDF  28 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC1307 Datasheet(HTML) 4 Page - Microchip Technology

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TC1307
DS21702A-page 4
 2002 Microchip Technology Inc.
Reset Threshold Voltage
VTH
2.59
2.55
2.63
—
2.66
2.70
V
V
TA = +25°C
TA = -40°C to +125°C
See Figure 4-2
Reset Circuit Supply Current
IVDET
—
20
40
µA
RESET = Open
Reset Threshold Voltage
Temperature Coefficient
VTH-TEMP
—30
—
ppm/°C
Detect Threshold to RESET
Active Time Delay
TVDET-RESET
—
135
—
µsec
VDET = VTH to VTH - 100 mV,
See Figure 4-2
Reset Time-out Period
TRESET
140
300
560
msec
See Figure 4-2
RESET Output Voltage Low
VOL-RES
——
0.3
VVDET = VTH-min
ISINK = 1.2 mA
——
0.4
VDET = VTH-min
ISINK = 3.2 mA
——
0.3
VDET > 1.0V ISINK = 50 µA
Note 8, See Figure 4-2
RESET Output Voltage High
VOH-RES
0.8*VDET
VDET-
1.5V
——
V
ISOURCE = 500 µA
Isource = 800 µA
VDET>VTH-max (Both cases),
See Figure 4-2
Temperature Ranges:
Maximum Junction Temperature
Range
TJ
-40
—
+150
°C
Maximum Junction Temperature
Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Package Resistances:
Thermal Resistance, 16L-QSOP
θJA
—
112.4
—
°C/W
EIA/JEDEC JESD51-751-7
4 Layer Board
Unless otherwise specified, all limits are established for VIN = VR+1, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = 25°C.
Boldface type specifications apply for junction temperatures, TJ (Note 9) of -40°C to +125°C.
Parameter
Sym
Min
Typ
Max
Units
Conditions
Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ (VR + 2.5%) + VDROPOUT.
2: VR is the nominal regulator output voltage. For example: VR = 1.8V, 2.5V, 2.8V or 3.0V.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) * 106 / (VR * ∆Temperature), VOUT-HIGH = Highest voltage measured over the tempera-
ture range. VOUT-LOW = Lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is
tested over a load range from 1mA to the maximum specified output current. Changes in output voltage due to heating
effects are determined using thermal regulation specification TCVOUT.
5: Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied.
Specifications are for a current pulse equal to ILMAX at VIN = 6.0V for t = 10 msec.
6: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
with a 1V differential applied.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper-
ature and the thermal resistance from junction to air. (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipa-
tion will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction
temperatures above 150°C can impact the device reliability.
8: VTH-MIN = 2.55V and VTH-MAX = 2.70V.
9: The Junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the Ambi-
ent temperature is not significant.



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