TC1307 datasheet(10/28 Pages) MICROCHIP

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TC1307

DS21702A-page 10

 2002 Microchip Technology Inc.

Note: Unless otherwise indicated, VIN = 3.8V, CIN = 10 µF ceramic (X5R), COUT = 1 µF ceramic (X5R), ILOAD = 100 µA,

SELECT12 = NC, SELECT34 = VIN, SHDN1/2/3/4 = VIN, TA = 25°C.

Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the

desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the

Ambient temperature is not significant.

FIGURE 2-31: Reset VOL-RES vs. ISINK.

FIGURE 2-32: Reset

VOL-RES

vs.

Junction

Temperature.

FIGURE 2-33: Reset VOH-RES vs. ISOURCE.

FIGURE 2-34: Reset

VOH-RES

vs.Junction

Temperature.

FIGURE 2-35: Power-Up RESET Timing.

FIGURE 2-36: Ground Current vs. Load Current.

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.0

2.0

4.0

6.0

8.0

10.0

Sink Current (mA)

VDET = 2.55V

0.05

0.1

0.15

0.2

0.25

0.3

0.35

-40

-25

-10

110 125

Junction Temperature (°C)

VDET = 2.55V

ISINK = 1.2 mA

ISINK = 3.2 mA

2.00

2.20

2.40

2.60

2.80

3.00

3.20

3.40

3.60

3.80

4.00

0.00

2.00

4.00

6.00

8.00

10.00

Source Current (mA)

VDET = 3.80V

5.91

5.92

5.93

5.94

5.95

5.96

5.97

-40

-25

-10

110 125

Junction Temperature (°C)

VDET = 6.0V

ISOURCE = 500 µA

ISOURCE = 800 µA

200

225

250

275

300

325

100

125

150

Load Current (mA)

VDET = VIN = 3 .8V

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