ML6554

11

NOVEMBER, 1999

Figure 10. Graphical Results Summary – 1S2P Test Board

POWER (W)

NATURAL CONVECTION

ΘJA TEST RESULTS

1.27mm PITCH PowerSOP™ 2

SLUG SOLDERED

FORCED CONVECTION

ΘJA TEST RESULTS

1.27mm PITCH PowerSOP™ 2

SLUG SOLDERED

60

40

20

0

0.2

1.0

1.4

1.8

0.6

0.4

1.2

1.6

2.0

0.8

0.0

60

40

20

0

AIR VELOCITY (LFPM)

0

200

300

500

400

100

16Ld PSOP2

2.3x3.1mm PAD

1.9mm DIE

16Ld PSOP2

2.3x3.1mm PAD

1.9mm DIE @ 0.8 WATTS

Figure 11. Test Board Layout for

DRAWING NUMBER

ENG-CB-1007 REV A

Applicable Jedec Spec

JC 51-X (Note 1)

(Sroposed Spec)

Substrate Material

FR-4

Dimensions (LxW) (Overall)

114.3 x 76.2mm

Dimensions (LxW) (Metallization)

55 x 65mm

Dimensions (LxW) (Inner Planes)

73 x 73mm

Thickness

1.6 mm

Pitch

1.27mm

Stackup (# Signal Layers, # Cu Planes)

1S2P

Cu Trace Coverage (Signal Layer)

12%

Cu Coverage (Internal Layer)

100%

Trace Width (Spec/Measured)

235.5±25.5/288µm

Trace Cu Thickness (Spec/Measured)

70±14/67µm

Inner Cu Thickness (Spec/Measured)

35±3.5/31µm

Build #

C1797

Note 1: Proposed Spec "Thermal Test Board with Two Internal Solid Copper Planes for leaded Surface Mount Packages".