AR0130CSSC00SPBA0-DP datasheet(38/53 Pages) ONSEMI

38 / 53 page

Package Dimensions

Figure 28:

48 iLCC Package Outline Drawing

0.2±0.1

1.250±0.125

1.35±0.05

0.725 TYP

4.45

4.15

0.525 TYP

0.125 TYP

8.9

4.45

Die

Center

Optical

Center

Optical

Area

First

Clear

Pixel

(4.87 CTR)

6.40 CTR CTR

7.28 = 0.10 CTR

(3.67 CTR)

5.2 CTR

6.227 CTR

10±0.075

5±0.075

0.4±0.05

48X

3.85

7.7

0.15

0.15 A

A B

3.85

7.7

0.15 A B C

10±0.075

0.7 TYP

ENCAPSULANT: EPOXY

SUBSTRATE MATERIAL: PLASTIC LAMINATE

0.50 THICKNESS

LID MATERIAL: BOROSILICATE GLASS 0.4 THICKNESS

REFRACTIVE INDEX AT 20°C = 1.5255 @ 546nm & 1.5231 @ 588nm

DOUBLE SIDE AR COATING: 530-570nm R<1%; 420-700nm R<2%

LEAD FINISH: GOLD PLATING, 0.5 MICRONS MINIMUM THICKNESS

IMAGE SENSOR DIE

DIMENSIONS IN MM. DIMENSIONS IN () ARE FOR REFERENCE ONLY.

DO NOT MEASURE PRINTED DRAWING.

NOTES

OPTICAL CENTER = PACKAGE CENTER. DIE CENTER OFFSET FROM PACKAGE CENTER:

X = 0.018, Y = -0.277MM

MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES: 1°

MAXIMUM TILT OF OPTICAL AREA RELATIVE TO SEATING PLANE A: 35 MICRONS

MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS: 50 MICRONS

AR0130CSSC00SPBA0-DP Datasheet(PDF) 38 Page - ON Semiconductor

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