KAI-08050 datasheet(29/31 Pages) ONSEMI

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KAI-08050 Datasheet(PDF) 29 Page - ON Semiconductor

29 / 31 page

KAI−08050

www.onsemi.com

MECHANICAL INFORMATION

Completed Assembly

Figure 26. Completed Assembly

Notes:

1. See Ordering Information for marking code.

2. No materials to interfere with clearance through

guide holes.

3. The center of the active image is nominally at the

center of the package.

4. Die rotation < 0.5 degrees

5. Internal traces may be exposed on sides of

package. Do not allow metal to contact sides of

ceramic package.

6. Recommended mounting screws: 1.6 X 0.35 mm

(ISO Standard); 0 – 80 (Unified Fine Thread

Standard)

7. Units: millimeters

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