TMP112-Q1

SLOS887D – SEPTEMBER 2014 – REVISED DECEMBER 2015

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6.4 Thermal Information

TMP112-Q1

DRL (SOT563)

UNIT

6 PINS

Junction-to-ambient thermal resistance

200

°C/W

Junction-to-case (top) thermal resistance

73.7

°C/W

Junction-to-board thermal resistance

34.4

°C/W

Junction-to-top characterization parameter

3.1

°C/W

Junction-to-board characterization parameter

34.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

TEMPERATURE INPUT

Temperature range

–40

125

°C

25°C, V+ = 3.3 V

±0.1

±0.5

Temperature accuracy

0°C to 65°C, V+ = 3.3 V

±0.25

±0.5

°C

(temperature error)

–40°C to 125°C

±0.5

±1.0

Accuracy vs supply

–40°C to 125°C

0.0625

±0.25

°C/V

Long-term stability

3000 Hours

< 1

LSB

Resolution (LSB)

0.0625

°C

DIGITAL INPUT/OUTPUT

Input capacitance

3

pF

Input logic high

0.7 × (V+)

3.6

V

Input logic low

–0.5

0.3 × (V+)

V

Input current

1

μA

0

0.4

Output logic low, SDA

V

0

0.2 × (V+)

0

0.4

Output logic low, ALERT

V

0

0.2 × (V+)

Resolution

12

Bits

Conversion time

One-shot mode

26

35

ms

CR1 = 0, CR0 = 0

0.25

CR1 = 0, CR0 = 1

1

Conversion modes

Conv/s

CR1 = 1, CR0 = 0 (default)

4

CR1 = 1, CR0 = 1

8

Timeout time

30

40

ms

4

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