LM7322MASLASHNOPB datasheet(21/39 Pages) TI1

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PD(MAX) =

150°C ± 125°C

165°C/W

= 0.15 W

PD(MAX) =

150°C ± 125°C

235°C/W

= 0.11 W

PD(MAX) =

150°C ± 25°C

165°C/W

= 0.76 W

PD(MAX) =

150°C ± 25°C

235°C/W

= 0.53 W

PD(MAX) =

TJ(MAX) - TA

TJA

LM7321, LM7322

www.ti.com

SNOSAW8E – MAY 2008 – REVISED SEPTEMBER 2015

Feature Description (continued)

The Op Amp Quiescent Power Dissipation is calculated as:

PQ = IS × VS

where

•

IS: Supply Current

•

VS: Total Supply Voltage (V

+ − V−)

(2)

The DC Load Power is calculated as:

PDC = IO × (Vr - Vo)

where

•

VO: Average Output Voltage

•

Vr: V

+ for sourcing and V− for sinking current

(3)

The AC Load Power is calculated as PAC = See Table 1.

Table 1 shows the maximum AC component of the load power dissipated by the op amp for standard Sinusoidal,

Triangular, and Square Waveforms:

Table 1. Normalized AC Power Dissipated in the Output Stage for Standard Waveforms

PAC (W.Ω/V

Sinusoidal

Triangular

Square

50.7 × 10−3

46.9 × 10−3

62.5 × 10−3

The table entries are normalized to VS

2/R

L. To figure out the AC load current component of power dissipation,

simply multiply the table entry corresponding to the output waveform by the factor VS

2/R

L. For example, with ±12-

V supplies, a 600-

Ω load, and triangular waveform power dissipation in the output stage is calculated as:

PAC = (46.9 × 10−

3) × (242/600) = 45.0 mW

(4)

The maximum power dissipation allowed at a certain temperature is a function of maximum die junction

temperature (TJ(MAX)) allowed, ambient temperature TA, and package thermal resistance from junction to ambient,

θJA.

(5)

For the LM732xx, the maximum junction temperature allowed is 150°C at which no power dissipation is allowed.

The power capability at 25°C is given by the following calculations:

For VSSOP package:

(6)

For SOIC package:

(7)

Similarly, the power capability at 125°C is given by:

For VSSOP package:

(8)

For SOIC package:

(9)

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