LM7322MASLASHNOPB datasheet(4/39 Pages) TI1

4 / 39 page

LM7321, LM7322

SNOSAW8E – MAY 2008 – REVISED SEPTEMBER 2015

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN Differential

±10

Output Short Circuit Current

See (3)

Supply Voltage (VS = V

+ - V−)

Voltage at Input/Output pins

V+ + 0.8

V−

− 0.8

Junction Temperature(4)

150

°C

Soldering

Infrared or Convection (20 sec.)

235

°C

Information:

Wave Soldering (10 sec.)

260

°C

Storage Temperature

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Short circuit test is a momentary test. Output short circuit duration is

infinite for VS ≤ 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5 ms.

(4)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(2)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

V(ESD)

Electrostatic discharge(1)

±1000

C101(3)

Machine Model

200

(1)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(2)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply Voltage (VS = V

+ - V−)

2.5

Temperature Range(1)

−40

125

°C

(1)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB.

7.4 Thermal Information

LM7321

THERMAL METRIC(1)

D (SOIC)

DBV (SOT)

DGK (VSSOP)

UNIT

8 PINS

5 PINS

8 PINS

RθJA

(2)

Junction-to-ambient thermal resistance

165

325

235

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB.

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