DLP5500

DLPS013F – APRIL 2010 – REVISED MAY 2015

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Table of Contents

9.3

Feature Description................................................. 21

1

Features .................................................................. 1

9.4

Device Functional Modes........................................ 24

2

Applications ........................................................... 1

9.5

Window Characteristics and Optics ....................... 24

3

Description ............................................................. 1

9.6

Micromirror Array Temperature Calculation............ 25

4

Typical Application Schematic ............................. 1

9.7

Micromirror Landed-on/Landed-Off Duty Cycle ...... 27

5

Revision History..................................................... 2

10

Application and Implementation........................ 29

6

Description (continued)......................................... 4

10.1

Application Information.......................................... 29

7

Pin Configuration and Functions ......................... 4

10.2

Typical Application ................................................ 30

8

Specifications......................................................... 7

11

Power Supply Recommendations ..................... 32

8.1

Absolute Maximum Ratings ...................................... 7

11.1

DMD Power-Up and Power-Down Procedures..... 32

8.2

Storage Conditions.................................................... 7

12

Layout................................................................... 32

8.3

ESD Ratings.............................................................. 7

12.1

Layout Guidelines ................................................. 32

8.4

Recommended Operating Conditions ....................... 8

12.2

Layout Example .................................................... 33

8.5

Thermal Information ................................................ 10

13

Device and Documentation Support ................. 34

8.6

Electrical Characteristics......................................... 10

13.1

Device Support .................................................... 34

8.7

Timing Requirements .............................................. 11

13.2

Documentation Support ........................................ 34

8.8

System Mounting Interface Loads .......................... 15

13.3

Related Documentation......................................... 34

8.9

Micromirror Array Physical Characteristics ............. 16

13.4

Community Resources.......................................... 34

8.10

Micromirror Array Optical Characteristics ............. 17

13.5

Trademarks ........................................................... 35

8.11

Window Characteristics......................................... 18

13.6

Electrostatic Discharge Caution ............................ 35

8.12

Chipset Component Usage Specification ............. 18

13.7

Glossary ................................................................ 35

9

Detailed Description ............................................ 19

14

Mechanical, Packaging, and Orderable

9.1

Overview ................................................................. 19

Information ........................................................... 35

9.2

Functional Block Diagram ....................................... 20

5 Revision History

Changes from Revision E (September 2013) to Revision F

Page

•

Added ESD Ratings, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

•

•

•

Added Max Recommended DMD Temperature – Derating Curve......................................................................................... 9

•

Added LVCMOS Output Measurement Condition Figure..................................................................................................... 10

•

•

•

Changed SCP Bus Diagrams ............................................................................................................................................... 11

•

Added LVDS Voltage Definition Figure ................................................................................................................................ 12

•

Changed LVDS Waveform Requirements Figure................................................................................................................. 13

•

Added LVDS Equivalent Input Circuit Figure ....................................................................................................................... 13

•

Added LVDS & SCP Rise and Fall Time Figures................................................................................................................. 14

•

Moved the Mechanical section from Recommended Operating Conditions table to the System Mounting Interface

Loads section ...................................................................................................................................................................... 15

•

Added Micromirror Array Physical Characteristics section .................................................................................................. 16

•

Changed Micromirror Array Physical Characteristics Figure to generic image (M x N)....................................................... 16

•

Added Micromirror Array Optical Characteristics section .................................................................................................... 17

•

Changed specular reflectivity wavelength range to 420 - 700 nm (from 400 - 700 nm) to match Recommended

Operating Conditions ............................................................................................................................................................ 17

•

Changed Micromirror Landed Orientation and Tilt Figure to generic image (M x N) ........................................................... 18

2

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