VX6953CB datasheet(101/107 Pages) STMICROELECTRONICS

101 / 107 page

8209023 Rev 5

101/107

VX6953CB

Mechanical

14.1

Packaging and delivery

This module has been specifically designed to ensure that the lens barrel is sub-flush to the

top surface of the lens mount. ST recommends that zero pressure is applied to the top

surface of the lens barrel during the assembly processes or by attaching baffles/spacers. If

any pressure is applied to the lens barrel surface, this could lead to a significant degradation

in image sharpness. ST’s recommended SMoP package handling guidelines are available

on request.

The camera module should not be subjected to any hot manufacturing process as this may

lead to degradation of the image performance. Any hot manufacturing process performed

on the device must be agreed with ST, without prior agreement ST will not accept liability to

any degradation in module performance.

Figure 50. Marking diagram

Table 61. Substrate marking codification

Line

Description

Line one (953C)

953 is the product code

C is the die revision

Line two (PLLL)

P is the assembly plant

LLL is the B/E sequence

Line three(YWWA)

Y is the year

WW is the week number

A is the module revision

Pin 1

VX6953CB Datasheet(PDF) 101 Page - STMicroelectronics