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TDA8922TH Datasheet(PDF) 19 Page - NXP Semiconductors

Part # TDA8922TH
Description  2 x 25 W class-D power amplifier
PDF  36 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8922TH Datasheet(HTML) 19 Page - NXP Semiconductors

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MGU997
TDA8922TH
C20
330 pF
C10
100 nF
C12
100 nF
C11
220 nF
C9
220 nF
C8
220 nF
on
mute
off
R5
30 k
Ω
C17
470 nF
R7
5.6 k
Ω
C16
470 nF
R6
5.6 k
Ω
J4(1)
J3
C21
330 pF
8
10
12
7
6
1
3
24
18
13
19
23
20
VDDA1
VSSA1
OSC
MODE
VDDA
VSSA
VSSA
9
11
2
5
15
OUT1
BOOT1
BOOT2
OUT2
16
21
22
4
IN1
+
IN1
−
IN2
+
IN2
−
SGND1
SGND
C13
100 nF
C14
220 nF
C15
100 nF
14
17
VDDP1
VSSP1
VDDP
VDDA
VSSP
R4 39 k
Ω
R3
39 k
Ω
Z1
5.6 V
S1
C34
100 nF
C35
220 nF
C36
100 nF
C32
220 nF
C33
47 pF
VSSA2
VDDA2
VSSD
STABI
PROT
HW
VSSA
VDDA
VSSP
C37
100 nF
C38
220 nF
C39
100 nF
C22
15 nF
C23
15 nF
C30
15 nF
C31
15 nF
C26
470 nF
C27
470 nF
R10
4.7
Ω
C24
560 pF
R11
4.7
Ω
C25
560 pF
R12
22
Ω
R13
22
Ω
C28
220 nF
C29
220 nF
L5
27
µH
L6
27
µH
VDDP2
VSSP2
VDDP
SGND
SE 4
Ω
SE 4
Ω
OUT1
−
OUT1
+
OUT2
−
OUT2
+
VSSP
SGND2
J2(4)
J1
in 1
in 2
C18
470 nF
R8
5.6 k
Ω
C19
470 nF
R9
5.6 k
Ω
(2)
BTL 8
Ω
L1
BEAD
L2
BEAD
C1
470
µF
C3
47
µF
C2
470
µF
C6
100 nF
C7
100 nF
VDDP
VSSP
R1(3)
10 k
Ω
R2(3)
9.1 k
Ω
VDDA
VSSA
C4
47
µF
C5
47
µF
GND
VSS
VDD
L3
BEAD
L4
BEAD
+25 V
−25 V
SGND
Fig.10 Single-chip class-D audio amplifier application diagram (reference design for SE and BTL).
(1) BTL: remove In2, R8, R9, C18, C19, C21 and close J3 and J4.
(2) BTL: connect loudspeaker between OUT1+ and OUT2
−.
(3) BTL: R1 and R2 are only required when an asymmetrical supply is used (VSS = 0 V).
(4) In case of hum, close J1 and J2.
Every decoupling to ground (plane) must be made as close as possible to the pin.
To handle 20 Hz under all conditions in stereo SE mode, the external power supply
needs to have a capacitance of at least 4700
µF per supply line; VP = ±27 V (max).



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