ADS5463-EP

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

AVDD5 to GND

6

Supply voltage

AVDD3 to GND

5

V

DVDD3 to GND

5

AC signal

–0.3 to (AVDD5 + 0.3)

Voltage difference between

0.4 to 4.4

V

pin and ground

1.0 to 3.8

AC signal

–5.2 to 5.2

Voltage difference between

–4 to 4

V

these pins

–2.8 to 2.8

AC signal

–0.3 to (AVDD5 + 0.3)

Voltage difference between

0.1 to 4.7

V

pin and ground

1.1 to 3.7

AC signal

–3.3 to 3.3

Voltage difference between

–3.3 to 3.3

V

these pins

–2.6 to 2.6

–0.3 to (DVDD3 + 0.3)

V

Characterized case operating temperature range

–55 to 125

°C

Maximum junction temperature

150

°C

Storage temperature range

–65 to 150

°C

ESD Human Body Model (HBM)

2

kV

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

Valid when supplies are within recommended operating range.

THERMAL CHARACTERISTICS

(1)

PARAMETER

TEST CONDITIONS

TYP

UNIT

Soldered thermal pad, no airflow

23.7

θJA

Soldered thermal pad, 150 LFM airflow

17.8

°C/W

Soldered thermal pad, 250 LFM airflow

16.4

θJP

Bottom of package (thermal pad)

2.99

°C/W

(1)

Using 36 thermal vias (6 × 6 array). See Application Information section.

(2)

(3)

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