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DESCRIPTION (CONTINUED)

THS6022

SLOS225D – SEPTEMBER 1998 – REVISED JULY 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

The THS6022 is packaged in the patented PowerPAD™ package. This package provides outstanding thermal

characteristics in a small-footprint package that is fully compatible with automated surface-mount assembly

procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By

simply soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from

the junction.

AVAILABLE OPTIONS

PACKAGED DEVICE

PowerPAD™ PLASTIC

MicroStar Junior™

EVALUATION MODULE

(GQE)

0

°C to 70°C

THS6022CPWP

THS6022CGQE

THS6022EVM

–40

°C to 85°C

THS6022IPWP

THS6022IGQE

–

(1)

The PWP packages are available taped and reeled. Add an R suffix to the device type (e.g.,

THS6022CPWPR)

TERMINAL FUNCTIONS

TERMINAL

PWP PACKAGE

GQE PACKAGE

NAME

TERMINAL NO.

TERMINAL NO.

1OUT

2

A3

1IN–

5

F1

1IN+

4

D1

2OUT

13

A7

2IN–

10

F9

2IN+

11

D9

3, 12

B1, B9

1, 14

A4, A6

NC

6, 7, 8, 9

NA

3

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