LP2996AMRESLASHNOPB datasheet(19/29 Pages) TI1

19 / 29 page

LP2996A

www.ti.com

SNOSCY7 – JUNE 2014

10 Layout

10.1 Layout Guidelines

1. The input capacitor for the power rail should be placed as close as possible to the PVIN pin.

2. VSENSE should be connected to the VTT termination bus at the point where regulation is required. For

motherboard applications an ideal location would be at the center of the termination bus.

3. VDDQ can be connected remotely to the VDDQ rail input at either the DIMM or the Chipset. This provides the

most accurate point for creating the reference voltage.

4. For improved thermal performance excessive top side copper should be used to dissipate heat from the

package. Numerous vias from the ground connection to the internal ground plane will help. Additionally these

can be located underneath the package if manufacturing standards permit.

5. Care should be taken when routing the VSENSE trace to avoid noise pickup from switching I/O signals. A

0.1uF ceramic capacitor located close to the SENSE can also be used to filter any unwanted high frequency

signal. This can be an issue especially if long SENSE traces are used.

6. VREF should be bypassed with a 0.01 µF or 0.1 µF ceramic capacitor for improved performance. This

capacitor should be located as close as possible to the VREF pin.

10.2 Layout Examples

The LP2996A layout is very similar to the LP2998/Q layout. This is because the main difference between the two

IC's is the wider temperature range, -40°C to 125°C, which the LP2998/Q offers. As such, the below example

shows the layout from a LP2998EVM. These layout examples can be used to evaluate the LP2996A.

Figure 29. LP2998EVM SO PowerPAD Layout Example (Front)

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LP2996AMRE/NOPB Datasheet(PDF) 19 Page - Texas Instruments