2004 Sep 03

18

Philips Semiconductors

Product specification

Satellite Zero-IF QPSK/8PSK

downconverter with PLL synthesizer

TDA8260TW

PACKAGE OUTLINE

UNIT

A1

A2

A3

bp

eHE

LLp

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

8

0

o

o

0.1

DIMENSIONS (mm are the original dimensions).

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

SOT633-3

04-01-22

θ

A

A1

A2

Eh

Dh

D

Lp

detail X

E

Z

exposed die pad side

e

c

L

X

(A3)

0.25

1

19

38

20

y

bp

HE

1.05

0.80

0.30

0.19

Dh

3.65

3.45

Eh

2.85

2.65

0.20

0.09

12.6

12.4

6.2

6.0

8.3

7.9

0.65

1

0.2

0.6

0.2

0.1

0.75

0.45

A

HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads;

body width 6.1 mm; lead pitch 0.65 mm; exposed die pad

SOT633-3

A

max.

1.2

0

2.5

5 mm

scale

- - -

- - -

- - -

pin 1 index