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TMS570LS0332PZ Datasheet(PDF) 18 Page - Texas Instruments

Part # TMS570LS0332PZ
Description  16- and 32-Bit RISC Flash Microcontroller
PDF  110 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TMS570LS0332PZ Datasheet(HTML) 18 Page - Texas Instruments

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TMS570LS0432, TMS570LS0332
SPNS186B – OCTOBER 2012 – REVISED JUNE 2015
www.ti.com
5
Specifications
5.1
Absolute Maximum Ratings
(1)
Over Operating Free-Air Temperature Range
MIN
MAX
UNIT
VCC
(2)
–0.3
1.43
Supply voltage
VCCIO, VCCP
(2)
–0.3
4.6
V
VCCAD
–0.3
3.6
All input pins
–0.3
4.6
Input voltage
V
ADC input pins
–0.3
4.6
IIK (VI < 0 or VI > VCCIO)
–20
20
All pins, except ADIN[21:20,17:16,11:0]
Input clamp current
IIK (VI < 0 or VI > VCCAD)
mA
–10
10
ADIN[21:20,17:16,11:0]
Total
–40
40
Operating free-air
–40
125
°C
temperature, TA
Operating junction
–40
150
°C
temperature, TJ
Latch-up performance
I-test, All I/O pins
–100
100
mA
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to their associated
grounds.
5.2
ESD Ratings
VALUE
UNIT
Human Body Model (HBM), per AEC Q100-002(1)
±2
kV
Electrostatic discharge (ESD)
All pins except corner pins
±500
V
V(ESD)
Charged Device Model (CDM),
performance:
Corner pins (1, 25, 26, 50, 51, 75,
per AEC Q100-011
±750
V
76, 100)
(1)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS
‑001 specification.
5.3
Power-On Hours (POH)
(1) (2)
JUNCTION
NOMINAL CORE VOLTAGE (VCC)
LIFETIME POH
TEMPERATURE (Tj)
1.2
105ºC
100K
(1)
This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms
and conditions for TI semiconductor products.
(2)
To avoid significant degradation, the device power-on hours (POH) must be limited to those specified in this table. To convert to
equivalent POH for a specific temperature profile, see the Calculating Equivalent Power-on-Hours for Hercules Safety MCUs Application
Report (SPNA207).
18
Specifications
Copyright © 2012–2015, Texas Instruments Incorporated
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Product Folder Links: TMS570LS0432 TMS570LS0332



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